Ultra-bright passivated aluminum nano-flake pigments

ABSTRACT

An organic release agent is vacuum deposited over a substrate and surface treated with a plasma or ion-beam source in a gas rich in oxygen-based functional groups to harden a very thin layer of the surface of the deposited layer in passivating environment. Aluminum is subsequently vacuum deposited onto the hardened release layer to form a very flat and specular thin film. The film is exposed to a plasma gas containing oxygen or nitrogen to passivate its surface. The resulting product is separated from the substrate, crushed to break up the film into aluminum flakes, and mixed in a solvent to separate the still extractable release layer from the aluminum flakes. The surface treatment of the release layer greatly reduces wrinkles in the flakes, improving the optical characteristics of the flakes. The passivation of the flake material virtually eliminates subsequent corrosion from exposure to moisture.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. Ser. No. 11/335,039, filed onJan. 18, 2006 and now published as U.S. 2006/0117988 now U.S. Pat. No.9,082,320, which in turn is a continuation-in-part application of U.S.Ser. No. 10/355,373, filed on Jan. 31, 2003 and now abandoned. Thedisclosure of each of the above identified applications is incorporatedherein by reference.

BACKGROUND OF THE INVENTION

Field of the Invention

This invention is related in general to metallic flakes of reflective,conductive and/or transparent material used in a variety ofapplications, such as in the manufacture of clear conductive surfacesand inks and paints for highly reflective coatings. In particular, theinvention pertains to a method of producing highly reflective,passivated, nano-thick aluminum flakes from metal/organic multilayerstructures deposited entirely in a vacuum environment. The multilayerdeposition may be carried out either on a web using a roll-to-rollprocess or on a rotating drum, where thousands of aluminum layers areinterleaved with specially prepared organic layers and passivated invacuum. In either case, the aluminum layers are suitable for reductionto single flakes for the production of highly reflective pigments.

Description of the Related Art

Metallized films are commonly produced for a variety of applicationsthat include decorative, packaging and low-emissivity applications forwhich high reflectivity is desirable. In conventional metal-flakepigment technology, such as in the production of aluminum pigments, apolymer film web is coated with a dissolvable polymer layer atatmospheric conditions and a nano-thick aluminum layer is deposited overit in a vacuum chamber. This process may be repeated several times onone or both sides of the web before the aluminum is removed from the weband reduced to a nano-flake pigment.

Polymer/aluminum multilayer structures may also be produced entirely ina vacuum chamber by depositing both materials in successive layers. Suchstructures have been used advantageously in the past to produce aluminumpigments in powder form where the polymer is retained with the aluminumparticle (see, for example, U.S. Pat. No. 5,912,069; and A. Yializis, etal., “Low Emissivity Polymer-Metal Pigments and Coatings,” 1997 Meetingof The IRIS Group On Camouflage Concealment and Deception, Volume 1,October 1997). The same process has been utilized to manufacturemultilayer capacitors (see U.S. Pat. No. 5,018,048, U.S. Pat. No.5,125,138, and U.S. Pat. No. 5,731,948) wherein the highly cross-linkedpolymer layers are used as the dielectric between the aluminum electrodelayers.

Commonly owned U.S. Pat. No. 6,270,841, herein incorporated byreference, described producing aluminum flakes by evaporating apolyethylene-oligomer in a vacuum chamber, depositing it as a solidcoating (0.5 to 1.0 micron thick) on a cold polyester web, and thendepositing an aluminum film in-line on top of the oligomer releasecoating according to conventional vacuum deposition. Aluminum metalflakes were recovered from the bulk deposition product by crushing thealuminum film within it to produce flakes, and then either by melting ordissolving the release material away from the flakes. Similaraluminum-flake products were produced using poly(.alpha.-methylstyrene)oligomers as the release layer. (Aluminum readily oxidizes into anon-conductive material; therefore, it is not suitable for manufacturingconductive layers.)

Metallic particles have also been utilized to manufacture conductivesurfaces used in many modern electronic applications. Conductive platesand inks incorporate metal pigments composed of materials such as gold,silver, chromium, palladium, platinum, nickel, indium and copper.Typically, these conductive surfaces are manufactured by dispersing ametallic or metal-oxide powder in a binder and applying the mixture as acoating over a substrate. More recently, for the display industry, clearconductive inks have been developed that utilize micro- and nano-sizeparticles of conductive oxides, such as ITO and IZO. These nano-sizepowders are manufactured chemically by precipitation from a solution ormechanically by grinding solid nuggets. The resulting powder particles,normally in the order of nanometers in nominal diameter, are notoptically transmissive even though the material in thin-film form may betransparent. This is because the light scattering produced by reflectionof dispersed random-shape particles greatly reduces the transparency ofthe bulk material, just as in the case of pulverized glass particles.Therefore, the application of a conductive powder to a clear substratesuch as plastic or glass, while producing a conductive surface, tends toyield a translucent but not perfectly clear layer even when ITO or IZOis used.

It has been known that the metal-oxide compounds commonly used in themanufacture of conductive layers, most commonly ITO and IZO, remaintransparent in flake form because of the high aspect ratio associatedwith the flake form (i.e., the ratio of the nominal diameter of thetwo-dimensional surface to the thickness of the flake). Accordingly, theuse of metal-oxide particles in flake form to manufacture clearconductive surfaces is very very desirable.

U.S. Ser. No. 10/355,373, herein incorporated by reference, and U.S.Pat. No. 6,270,841 and U.S. Pat. No. 6,398,999 describe a process forproducing such metal flakes. A polymeric release agent isflash-evaporated and deposited onto a support substrate underconventional vacuum-deposition conditions and a pigment (i.e., aluminum)or a conductive-material precursor (e.g., ITO) is subsequently vacuumdeposited onto the resulting release layer in the same process chamberto form a very thin film. The resulting multilayer product is thenseparated from the support substrate, crushed to brake up the film intoflakes, and heated or mixed in a solvent to separate the soluble releaselayer from the flakes. Thus, by judiciously controlling the depositionof pigment (or conductive material) on the release layer, flakes may beobtained with the desired optical and physical characteristics.

As a result of the continuous vacuum deposition of the release layer andthe pigment (or conductive material) in rapid succession on a rotatingdrum to form a continuous two-layer spiral of arbitrary length, theprocess of Ser. No. 10/355,373 allows the production of a large bulkvolume of pigment (or conductive-material) film embedded between releaselayers, which in turn yields extensive quantities of flakes by crushingthe layered product and heating or dissolving the release material.

The flakes so produced are mixed in conventional carriers and binders tomake dispersions suitable for application as inks and coatings overclear substrates. Thus, the process of Ser. No. 10/355,373 producespigment and ITO flakes without also introducing the opacity that ischaracteristic of the prior-art inks and coatings based on powders.Because of the higher aspect ratio of flakes with respect to powders,the conductive flakes also provide greater contact among adjacentparticles and therefore also greater conductivity than is typicallyachievable by the use of powders.

The technology described in Ser. No. 10/355,373 permitted themanufacture of pigment and conductive flakes, rather than powders, inbulk and in a single process, with the attendant benefits associateswith the single-layer flake structure. In particular, these benefitsincluded an expected higher reflectivity or transparency than powders,as applicable (with respect to optical properties), and higherconductivity than powders with respect to applications requiring goodconductivity.

Unfortunately, it was discovered that these improved propertiesdeteriorate rapidly as soon as the flakes are utilized as pigments orconductive films. In the case of aluminum pigments, in particular, theflakes lose gloss and brightness immediately upon separation from therelease material. Similarly, the conductivity of conductive films tendsto decrease with time. The present invention is directed at providing asolution to these problems by perfecting the manufacturing processdescribed in Ser. No. 10/355,373.

SUMMARY

In view of the foregoing, this invention is directed at the developmentof a general approach to produce an optically flat and dissolvableorganic substrate for the deposition of metallic layers in multilayerstructures. These metallic/organic composites are produced entirely in avacuum chamber either by deposition on a web using a roll-to-rollprocess or by continuous deposition on a rotating drum. In addition, theinvention is directed at a process that includes, particularly in thecase of aluminum, the passivation of both sides of the aluminum layersbefore they are exposed to moisture in any form.

It is noted that the term “passivation” is used in the art to refer tothe process of treating a metal layer to alter its susceptibility todeterioration from exposure to environmental factors, especiallymoisture. In order to produce a passivated aluminum coating, it isnecessary to create a stable Al₂O₃ or AlN protective layer on thesurface of the aluminum film. When the film is produced by metallizing aweb substrate on a roll in a vacuum chamber and the roll is removed fromthe chamber, its subsequent exposure to air allows the formation of aprotective aluminum oxide layer that heretofore has been deemed adequatein the art. Given that air contains both oxygen and some moisture,though, some deterioration of the aluminum layer takes placeimmediately, especially when the first exposure of the freshly depositedaluminum layer occurs in a high-humidity environment. This exposure to acombination of air and moisture produces a hydrated aluminum oxide,Al₂O₃. (H₂O), which is structurally inferior to Al₂O₃. Thus, thealuminum material continues to be sensitive to moisture, producingcorrosion and reducing the brightness and useful life of reflectivealuminum flakes.

In the case of multilayer capacitor structures, the aluminum layers arenormally passivated simply by exposure to a high temperature afterdeposition (which may be done because the interleaved polymer layers arecross-linked and can withstand high temperatures). In aluminum/polymermultilayer composites where the bulk material is reduced to powder forpropellant and explosive applications (see U.S. Pat. No. 5,912,069), thealuminum is kept in unoxidized form until used in order to enhance theexothermic reaction that takes place when it is reacted with anoxidizing agent.

Similarly, in applications where the multilayer structure is reduced tosingle-layer aluminum flakes (e.g., Ser. No. 10/355,373 and U.S. Pat.No. 6,398,999), in order to avoid an explosion, the aluminum is kept inthe same solvent used to dissolve the organic layer until it isincorporated into a binder for further use. Because the solventstypically used for pigment applications (such as acetone, toluene, andethyl acetates) contain some amount of water and dissolved air thatproduce hydrated oxides in the flake-material film, over time thiscauses noticeable deterioration in the integrity of the flakes. Ifsolvents that contain larger quantities of water are used (likeisopropyl alcohol), the highly exothermic reaction of aluminum withwater causes a rapid corrosion of the nano-flake, with the possibilityof even causing an explosion.

The invention is based on an understanding of the mechanisms thatproduce the deterioration of the properties of flakes manufactured bysequential vacuum deposition of organic and metallic flake-precursormaterials, as described above. One problem lies in the fact that theorganic release material must remain extractable (either by dissolutionor by melting) after the vacuum deposition process. Therefore, it hasnot been cured to harden it after condensation and consequently thesubsequent vacuum deposition of the flake-precursor material has beencarried out over a relatively soft release layer. Both Ser. No.10/355,373 and U.S. Pat. No. 6,398,999 describe the use of polymericrelease materials that are evaporated and re-deposited in vacuum assolid polymers, but that are not further cured after deposition.

This produces a rough surface in the release layer and a correspondingmicro-roughness and wrinkles in the metal film deposited over it thatyield uneven, wrinkled, flakes when the film is crushed to separate theflake product. In the case of aluminum pigment, this problem greatlyreduces the reflective properties of the flake in the visible spectrum.These less-than-perfectly-flat flakes do not reflect light as uniformlyas flat flakes would (or are not as transparent, in the case of ITO andIZO), which reduces the efficacy of the process to produce high-qualityreflective (or transparent) flakes. Similarly, since wrinkled flakes donot extend laterally as much as flat flakes of equal surface would, thephysical contact between adjacent flakes and the conductivity of thefilm resulting from their agglomeration is also reduced.

Conventional organic release materials melt at temperatures of the orderof 80 C-150 C. Therefore, after they are vacuum deposited on a rotatingdrum, the heat produced by the subsequent deposition of a metal film cansoften and wrinkle the surface of the organic layer. This isparticularly obvious when the condensation drum is rotating at highspeeds and there is little time between condensation and exposure to theheat produced by the immediately following metal deposition source. Athigh drum speeds the surface of the organic material does not have timeto reach equilibrium with the cold drum before it is re-heated by themetallic deposit. Thus, although the heat is not sufficient to re-meltthe organic layer, its surface can wrinkle and, for example, reduce thereflectivity of a deposited aluminum layer in the visible spectrum. Notethat the same problem is not as significant in the infrared (IR)spectrum because IR reflection can remain specular (micron-sizeroughness does not affect radiation with wavelength of 2-15 μm). Theterm specular is used herein, as in optics, to refer to a surface havingmirror-like reflection in which light from a single incoming directionis reflected onto a single outgoing direction, as described by the lawof reflection.

The specularity of a deposited aluminum layer could be increased bydepositing a cross-linked polymer layer on the dissolvable organiclayer, thus eliminating the effect of heat on the dissolvable substrate.(See A. Yializis et al., “Low Emissivity Polymer-Metal Pigments andCoatings,” 1997 Meeting of The IRIS Group On Camouflage Concealment andDeception, Volume 1, October 1997. In such a case, though, the thickercomposite flake would necessarily incorporate a cross-linked polymerlayer that is difficult to process for many ink and paint applicationsand that, therefore, would have limited applications. Therefore, thisapproach is not desirable for reflective and conductive inks andpigments.

Particularly with respect to aluminum pigment flakes, another problemlies in the presence of moisture at each of the various steps leading tothe final pigment product. Most notably, the solvents in which therelease layers are usually dissolved to separate them from the aluminummaterial (organic solvents such as acetone, toluene, and ethyl acetates)contain some amount of water. This leads to the formation of corrosionin the aluminum film (mostly in the form of hydrated oxides), which overtime produces noticeable deterioration in the integrity of the flakes.As a result, the reflectivity and brightness of the pigments decreasenoticeably and soon to levels that are commercially unacceptable.

Therefore, according to one aspect of the present invention, a differentkind of release material is used, namely one that can be hardened at athin surface layer while maintaining its extractability. Such a releaseagent is flash-evaporated and condensed under conventionalvacuum-deposition conditions. Then, prior to deposition of the metallicflake-precursor material, the surface of the release film is treatedwith a plasma source (operating in DC or RF) or an ion beam (with ionsor neutral particles) in order to produce a very thin layer of flat andsmoothed hardened surface for receiving the subsequent deposition offlake-precursor material. The degree of such surface treatment iscontrolled to obtain the hardened surface without affecting theextractability of the release layer, as this term is herein defined.

As a result of this surface treatment, the flakes obtained aftercrushing the flake-precursor film and extracting the release materialare much flatter and shinier (or more transparent, as applicable) thanflakes produced without the surface treatment. The conductivity of inksand paints incorporating such flakes is similarly improved. Thus, byjudiciously controlling the surface treatment of the release layer, theflatness and the corresponding optical and electrical properties of theflakes are optimized.

According to another aspect of the invention applicable particularly tothe manufacture of aluminum pigment, the vacuum deposition of thealuminum film is both preceded and followed by exposure to a plasma orion-beam gas containing a passivating component such as oxygen ornitrogen. It is known that in a plasma or ion-beam gas a smallpercentage of the gas is ionized. Therefore, the presence of molecularoxygen produces an activated layer of neutral, ionized and atomic oxygenthat passivates the surface of the aluminum layer. (The same applies tonitrogen when the gas is used to protect the underlying metal by theformation of a nitride, rather than an oxide.) In the presence oforganic material, such activated species in the reactive gas plasmaproduce functional groups, such as carboxyl, hydroxyl and nitrilegroups, that also react with the aluminum and passivate the surface incontact with the organic coating. Thus, this treatment produces theimmediate formation of a protective aluminum-oxide (or nitride) layerthat prevents the subsequent deterioration of the film caused byexposure to environmental moisture. As a result, the aluminum flakesmanufactured by the process of the invention retain their reflectivityand gloss over time, thereby allowing the full practical realization ofthe advantages provided by the surface treatment of the release layer.

According to yet another aspect of the invention, the hardening of therelease-layer surface and the passivation of the underside of thesubsequently deposited aluminum film may be performed with the sameplasma or ion-beam unit simply by using a gas containing the passivatingcomponent under conditions designed to promote the formation of highlyreactive, ionized and activated species that produce the rapid oxidationof the metal film along with the cross-linking of the release layer.That is, the aluminum layer is deposited on a release-layer surface thatis not only hardened but is also rich with oxygen-based (ornitrogen-based) functional groups that cause the underside of thedeposited aluminum layer to also oxidize and be passivated prior toexposure to moisture.

According to one embodiment of the invention, the concurrent vacuumdeposition of the release layer and flake material is carried outcontinuously on a rotating drum, thereby producing a continuous spiralof arbitrary length. This allows the continuous in-line production of alarge bulk volume of flake-material film embedded betweenrelease-material layers, which in turn yields extensive quantities offlakes by crushing the layered product and heating or dissolving therelease material.

In another embodiment, the process is carried out in a vacuum chambercontaining a second unit for the deposition of release material at thetail end of the sequential stages. In such a case, instead of depositingcontinuously on a rotating drum, the process is carried out bydepositing sequentially a layer of release material and of flakematerial on a web moving between spools in one direction, and then bydepositing another layer of release material and flake material whilethe web is moved in the opposite direction, thereby forming a multilayerstructure of alternating release and flake materials on the web.Alternatively, after the deposition of the initial release layer, theprocess is carried out by depositing sequentially a layer of flakematerial and release layer on the web moving between the spools in onedirection, and then by depositing again flake material and releasematerial while the web is moving in the opposite direction. In thiscase, each deposited layer of release material has enough time to fullycool down and solidify on the spool before another aluminum layer isdeposited over it when the web is re-spooled in the opposite direction.In either case, the procedure is continued at will until the desirednumber of layers is obtained.

Various other purposes and advantages of the invention will become clearfrom its description in the specification that follows and from thenovel features particularly pointed out in the appended claims.Therefore, to the accomplishment of the objectives described above, thisinvention consists of the features hereinafter illustrated in thedrawings, fully described in the detailed description of the preferredembodiment and particularly pointed out in the claims. However, suchdrawings and description disclose but one of the various ways in whichthe invention may be practiced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic representation of a modified vacuum chamberaccording to the invention wherein the release material and the metallicfilm are deposited over a rotating drum.

FIG. 2 is a schematic representation of the vacuum chamber according tothe invention wherein the release material and the metallic film aredeposited over a web spooled back and forth

FIG. 3 is a schematic representation of a vacuum chamber as in FIG. 1with the addition of a curing station between the organic depositionstation and the first surface treatment station.

FIG. 4 is a schematic representation of a vacuum chamber as in FIG. 2with the addition of a first curing station between the first organicdeposition station and the first surface treatment station, and theaddition of another curing station between the second organic depositionstation and the second surface treatment station.

DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION

The invention is grounded on the idea of treating the surface of avacuum deposited organic release layer to harden it by cross-linking thesurface in its flat deposited form, and vacuum depositing a metallicflake-material precursor over the resulting hardened flat surface ofrelease layer in a continuous process to produce a bulk layeredstructure from which flakes can be manufactured in large quantity.Particularly in the case of metals that can benefit by the formation ofa protective oxide (or nitride), like aluminum, the invention alsoinvolves treating both sides of the deposited metallic film with apassivating gas.

For the purposes of this disclosure, metallic materials are defined asincluding metals as well as metal oxides, such as ITO and IZO. The termflake refers to a particle of substantially uniform thickness and havingan irregular planar shape with a nominal diameter at least one order ofmagnitude greater than the thickness. The terms nominal diameter anddiameter are used interchangeably with respect to a flake to representthe diameter of a circular shape having the same surface area as theplanar side of the flake. The term wrinkled is used with reference toflakes to mean containing planar irregularity or surface roughness(i.e., wrinkled means not flat). The above notwithstanding, it isunderstood that the flake-precursor film deposited on a drum or a rolledweb necessarily has some degree of curvature. Since such curvature isalmost imperceptible in a particle with the size of a flake, though, itis not considered a wrinkle for the purposes of this definition. Theterms flake material, flake precursor, flake-precursor material and thelike are used interchangeably to refer to any material which may bedeposited according to the invention to produce a film intended to becrushed to yield flakes.

The terms organic material, organic layer and release material are usedinterchangeably to refer to any substance conventionally used in the artto isolate interleaved layers of metallic flake-precursor material in acomposite structure that allows the subsequent separation of the flakeprecursor from the release material, either by melting or dissolving therelease material in a solvent. The terms extraction and extractable areused in this disclosure with reference to organic materials to mean thatthey can be separated from a multilayered metallic/organic structureeither by melting (fusible) or dissolution (soluble), or both. That is,an extractable release layer is one wherein the degree of cross-linkingintroduced by the surface treatment of the invention is not sufficientto prevent the subsequent dissolution or melting of the release layer toextract it from the multilayer structure produced by vacuum deposition.

The term oligomer is used herein to refer not only to molecular chainsnormally designated as such in the art (typically containing between twoand ten monomer molecules) but also to low-molecular weight polymers;specifically, oligomer is meant to encompass any polymerized moleculehaving a molecular weight sufficiently low to permit its vaporizationunder vacuum at a temperature lower than its temperature of thermaldecomposition. The term polymerizable is used to indicate the ability ofa monomer molecule with a single carbon-to-carbon double bond(monofunctional monomer) to bind with itself to form a longer polymericchain. The terms cross-linking and cross-linkable are used to indicatethe ability of an organic molecule to randomly bind with other moleculesof the same or another material. The term curing is used in general torefer to the process of solidifying the entire thickness of a layer oforganic material either by polymerization or cross-linking, or both. Forthe purposes of the present invention, however, curing refers to theprocess of solidifying the entire thickness of a layer of organicmaterial only by polymerization and suitable organic materials arejudiciously selected with that in mind in order to maintain theextractability of the layer.

The term wax is used in conventional manner to refer to any of variousnatural, oily or greasy, heat-sensitive substances consisting ofhydrocarbons or esters of fatty acids that are insoluble in water butsoluble in organic solvents. Inasmuch as the invention pertains in thesame way to both pigments and inks, when the term pigment alone is used,it is intended to refer to both pigments and inks unless otherwisespecified.

The term condensation refers to a phase-change process from gas toliquid (and subsequently solid) obtained upon contact with a surfacehaving a temperature lower than the dew point of the gas at a givenoperating pressure. The term surface treatment is used to refer to theeffect of a plasma source or an ion beam to cause superficialcross-linking of an organic layer under conditions that prevent it frombecoming non-extractable. The term surface passivation is used to referto the formation of a protective oxide or nitride layer on the surfaceof the metallic layer freshly deposited by the process of the invention.Such passivation is produced, without limitation, by a plasma source orion beam operated in the presence of molecular oxygen and/or nitrogen toproduce an activated layer of molecular, ionized and atomic particlesthat passivate the surface of the metal layer being treated,particularly aluminum, by the formation of superficial oxides and/ornitrides.

As those skilled in the art would readily appreciate, plasma sources mayinvolve electrons, UV radiation, ions, free radicals and neutralspecies, and ion beams may contain ions and/or neutral gas species thatcan be used to produce both surface treatment and passivation in varyingdegrees, depending on gas composition and operating conditions.

The term organic deposition is used to refer to conventionalflash-evaporation followed by condensation in a vacuum depositionprocess and/or apparatus for deposition an organic material.Flash-evaporation, as contrasted to generic evaporation, is used torefer to a process wherein an organic material is evaporated almostinstantaneously as a result of flow in fluid form over a hot evaporator,rather than by heating the material in bulk form. Finally, the terminorganic deposition is used to refer to any conventional vacuumdeposition process and/or apparatus for deposition a metal, dielectric,or other inorganic material, such as by resistive evaporation,sputtering, and reactive evaporation, as appropriate for a particularmaterial.

As described, the invention is practiced by depositing a thin film ofmetallic flake-precursor material over an organic release layer that hasbeen treated to harden its surface by cross-linking without affectingits bulk extractability, so that it can be subsequently separated fromthe flake material. The organic materials may be solid at roomtemperature, such as waxes or oligomers, that can be melted,flash-evaporated, and re-condensed as solids on a substrate. They mayalso be liquid, such as monofunctional monomers or oligomers that can beflash-evaporated directly, condensed as liquid layers on a substrate,and then polymerized (cured without cross-linking) to form a stilldissolvable (extractable) organic material on a web or a rotating drum.

The release material may consists of a non-polymeric substance (such aswaxes and organic small molecules with molecular weight between 200 and5,000—e.g., anthracene, anthraquinon, phthalic acid, phthalic anhydride,triphenyl methane), or a polymeric substance (such as polystyrene,polycycloaliphatic, polyfluorocarbon and polyethylene oligomers). Therelease material may also consist of monofunctional monomers oroligomers that polymerize and produce a linear thermoplastic material(e.g., acrylates and vinyls). The release material must be such that itcan be flash-evaporated and vacuum deposited to form an extractable(soluble and/or fusible) release layer appropriate for the subsequentmanufacture of flakes.

The surface treatment of the organic release material with a plasmasource or ion beam produces superficial cross-linking of a very thinsurface layer (which should not exceed 10 percent—preferably 5percent—of the total thickness of the release layer), so as to retainthe extractability of the release material. We found that such surfacecross-linking of paraffin wax, for example, can be so limited byexposure to a conventional plasma source for less that 1 second.

In order to practice the invention, a conventional vacuum chamber 10 isused with an organic deposition station 12 and an inorganic depositionstation 14 operating sequentially to enable the concurrent deposition ofthe release material and the flake precursor, as illustratedschematically in FIG. 1. The release material is melted, if necessary,injected into the evaporation section of the organic deposition station(the evaporator, not shown in the figure), and flash-evaporated uponcontact with a hot surface.

The flash-evaporation step is critical in producing a coating that has auniform thickness during long deposition runs that may last severalhours. The process is started by injecting the liquid organic materialinto an empty evaporator under accurately controlled conditions toproduce the desired thickness in the release layer. At any point intime, only a small quantity of material is allowed into the evaporatorfor continuous flash-evaporation of the material in fluid form. Underthese fast-processing conditions, the organic material is relativelyinsensitive to temperature as long as the temperature is high enough toflash-evaporate it. This is in contrast to conventional evaporationprocesses where the evaporator is filled with organic material and thethickness of the deposited layer is a function of evaporatortemperature, which can vary over time (especially as the organicmaterial is consumed) and produce correspondingly varying thicknesses inthe deposited layer.

The vapor of release material resulting from flash-evaporation accordingto the invention is then passed through a slit to reach the condensationsection of the organic deposition station 12 in the vacuum chamber. Uponcontact with a rotating cold drum 16 (typically kept at −20° C. to 30°C.), the vapor condenses and forms a uniform, homogeneous thin film thatquickly solidifies. As in prior-art organic deposition units, the thinfilm may be deposited to produce a film coating directly over the drum16 or over a continuously fed web substrate 18 in contact with the drumand spooled between a feed reel 20 and a take-up reel 22 (asillustrated).

According to the present invention, the film of release material sodeposited is immediately treated in-line in order to cross-link andharden its surface by exposure to a surface treatment station 24. Thismay be a conventional DC or RF plasma source or an ion beam. Thistreatment produces sufficient cross-linking and hardening of the mostsuperficial layer of the release film in its flat deposited condition toensure that the flake material is subsequently deposited over auniformly flat substrate. We found that exposure of waxes or lowmolecular-weight organic molecules to such conventional surfacetreatment for less than one second is sufficient to harden the surfaceas required to produce flat flakes while retaining the extractability ofthe release material.

As shown in FIG. 1, a metallic flake-precursor material is vacuumdeposited over the treated release layer in the inorganic depositionstation 14 (such as a resistive evaporation unit, a dual-magnetronsputtering unit, or an electron-beam evaporation unit, as applicable asa function of the metallic material being deposited). The metallic layeris preferably deposited in a thickness in the order of one hundredangstroms over a release layer of sub-micron thickness. For example,75-300 angstroms of aluminum or up to 1,000 angstroms of ITO would beresistively evaporated or sputtered, respectively, over a 0.05-0.5micron thick release layer. Therefore, the relative deposition ratesneed to be adjusted to produce the desired thickness of the respectivelayers. If the process is carried out continuously on a rotating drum,the concurrent deposition of release material and flake precursorproduces a continuous spiral of concentric layers of release andprecursor materials.

In order to ensure the uniform deposition of the vaporized metallicmaterial over the release layer, it is critical that the deposition rateof the station 14 be controlled precisely. Therefore, the web 18 spooledbetween the feed reel 20 and the take-up reel 22 may be advantageouslyutilized in conjunction with an optical densitometer 26 to set thecorrect deposition rate even when the material is intended to beultimately deposited on the rotating drum 16. The release and metalliclayers are first deposited over a web 20 moving from reel to reel andthe metal deposition rate is adjusted using the densitometer 26 tomonitor the thickness of the deposited metal layer. When the desiredthickness is achieved, the web 20 is cut without interrupting theoperation and the deposition is continued over the rotating drum 16 toproduce the multilayer release/metallic structure.

According to another aspect of the present invention pertainingparticularly to the production of aluminum flakes, the depositedaluminum film is passivated in-line in the vacuum chamber to preventsubsequent interaction with ambient moisture, which is now known toproduce corrosion and deterioration of the flake's physicalcharacteristics. This is achieved by exposing the top surface of thedeposited aluminum film to another surface treatment station 28 operatedwith a reactive gas (used to passivate) in sequence past the inorganicdeposition station 14. The station 28 may again be a plasma source or anion-beam unit operating with a gas containing a passivating component,such as oxygen and/or nitrogen. As explained above, this treatmentproduces a superficial layer of oxide and/or nitride (depending on theplasma gas used) that inhibits the formation of undesirable hydratedcompounds when the material is subsequently exposed to moisture.

At the same time, in order to also passivate the bottom layer of thealuminum layer, the hardening of the release-layer surface performed inthe surface treatment station 24 is also carried out with reactiveplasma or an ion-beam gas containing a passivating component. Thus, thealuminum film is then deposited on a release-layer surface that is richwith oxygen-based (or nitrogen-based) functional groups that passivatealso the underside of the aluminum layer while it is being deposited. Asa result, the aluminum flakes obtained by the process of the inventionretain indefinitely their reflectivity and brightness.

Upon separation from the drum, the release/flake-material layers areprocessed in conventional manner to separate the metallic layers fromthe composite structure. This may be accomplished by mechanical peeloff, by melting the release material, or by dissolving it in an organicsolvent. Preferably, the bulk product of deposition is crushed to yieldmultilayer particles of a desired size. These are then further reducedto smaller particles that eventually produce single flakes in a suitablesolvent that is also used to extract the release material from theflakes. Typically, this process yields high-aspect, flat flakes about5-20 μm in nominal diameter and up to 0.1 μm in thickness that areparticularly high in reflective, transparency, or conductivity,depending on the metallic material.

It is clear that the process of the invention could be carried out inequivalent fashion using the web 18 over which the release material andthe flake material are deposited, in that order, in the vacuum chamber10. As illustrated in FIG. 1, in such a case the web 18 is runcontinuously in contact with the cold surface of the drum 16, and thematerials are deposited over the web as it progresses from the feed reel20 to the take-up reel 22. Thus, a two-layer deposit is obtained (ametallic film and a layer of release material over the web), producing aspiral product that can be separated from the web and treated, asexplained above, to obtain flakes.

In a different implementation of the invention conducted over a web 18,a vacuum chamber 30 is fitted with an additional organic-depositionstation 32 in-line past the second surface treatment (passivation)station 28, as shown in FIG. 2. As a result of this configuration, theweb 18 may be sequentially passed through an organic-deposition station,a surface treatment station, an inorganic deposition unit, anothersurface treatment station, and another organic-deposition stationregardless of the direction of motion of the web. The first and secondorganic-deposition stations are operated alternately between passes inopposite direction, while the inorganic deposition and surface treatmentstations area always active. Operating in this manner, a multilayerstructure can be built more rapidly over the web by depositing a layerof release material and film of flake precursor at each pass. The secondin-line organic-deposition station is preferably operated during eachpass (rather than the first in-line station) in order to allow more timefor the deposited organic layer to cool down and solidify while restingin the reel before being re-spooled in the opposite direction. The restof the conditions remain the same, as detailed above.

When a polymerizable release layer is used as mentioned above (forexample, a monofunctional monomer or oligomer), it needs to be curedprior to the surface treatment step. Accordingly, a curing unit is usedahead of the surface treatment station (such as a conventionallyoperated electron beam or UV radiation unit). FIGS. 3 and 4 illustratevacuum chambers that include such curing units 34. The chambers areotherwise operated as described above.

The following examples illustrate the invention. The materials selectedfor these examples were non-polymeric waxes and low molecular-weightorganic release agents known to exhibit very low adhesion to substratefilms and other coatings (such as metals or metal oxides); polymericoligomers (e.g., polyethylene, polystyrene, polybicycloaliphatic,polyvinylidene fluoride); and monofunctional monomers and oligomers thatpolymerize to produce linear thermoplastic materials.

All examples were carried out in the same vacuum chamber at a maximumvacuum of about 10⁻⁴ torr, as indicated below. As those skilled in theart will readily appreciate, however, this pressure applies only to theinorganic deposition station, which is in the highest vacuum zone. Asillustrated in the figures, each function is preferably carried out in aseparate zone isolated from the other zones by partitions 40 in thevacuum chamber. For instance, the organic deposition stations 12, 32 maybe operated at any pressure less than 1 torr; the surface treatmentstations 24, 28 at 10⁻¹ to 10⁻³ torr; the curing units 34 at 10⁻³ to10⁻⁴ torr; and the feed and take-up sections are normally kept at at10⁻¹ to 10⁻³ torr. The pressure (vacuum) in each zone is regulated by acombination of the action of vacuum pumps and the release of material inthe section, which contributes to reducing vacuum.

Example 1 Non-Polymeric Release Material

A paraffin wax from Aldrich Chemical Company of Milwaukee, Wis., wasmelted at 80° C. and injected into a 10⁻³ to 10⁻⁶ torr vacuum chamber(operated at about 10⁻⁴ torr) to be flash-evaporated at about 300° C.The formed vapor, driven by vacuum, was passed through a slit nozzlefrom the evaporating area to a deposition chamber and deposited as asolid coating about 0.05-0.10 micron thick on a cold drum kept at about0° C. The wax film was immediately exposed to a plasma gas ofcomposition 80% Ar, 20% O₂. An aluminum film about 100 A thick wasresistively evaporated in-line on top of the treated release coating.The speed of the rotating drum was limited to about 100 linear metersper minute. Finally, the film of aluminum was exposed to a plasmaproduced with a plasma gas of composition 80% Ar, 20% O₂. A multilayersequential aluminum/release strap (about 5,000 layers) was formed. Afterdeposition, aluminum flakes were produced by crushing the depositedmaterial and then dissolving and extracting the release layers intoluene. The resulting flakes were about 100 A thick, about 10 μm innominal diameter, and optically flat, shiny and highly reflective.

The aluminum flakes so produced still exhibited a high reflectivity invisible light and high corrosion resistance, as indicated by maintainingtheir original specular reflectivity after a period of 10 months afterexposure to solvents and air, and thereafter. Aluminum flakes preparedwithout surface hardening and passivation are less reflective and turndarker during the solvent extraction process.

Example 2 Non-Polymeric

A non-polymeric carnauba wax from Aldrich Chemical Company of Milwaukee,Wis., was used as the release material in the vacuum chamber under thesame conditions of Example 1, except that it was melted at 120° C. andflash-evaporated at about 320° C. The resulting aluminum flakes were thesame in size, flat, and reflective as in Example 1. Though exposed toair and moisture, they retained their highly specular reflectivityseveral months after manufacture, and thereafter.

Example 3 Non-Polymeric Small Organic Molecule

Anthracene was used as the release material in the vacuum chamber underthe same conditions of Example 1, except that it was melted at 220° C.and flash-evaporated at about 300° C. The resulting aluminum flakes werethe same in size, flat, shiny and reflective as in Example 1. Exposed toair and moisture, they continued to retain their highly specularreflectivity six months after manufacture.

Example 4 Non-Polymeric Wax

A paraffin wax was used as the release material in the vacuum chamberunder the same conditions of Example 1, except that the aluminum wasdeposited in thicknesses of about 75 and 200 angstroms in separate runs.The resulting aluminum flakes were approximately 75 and 200 angstromthick, respectively, about 10 μm in nominal diameter, and opticallyflat, and reflective. Exposed to air and moisture, they continued toretain their specular reflectivity six months after manufacture.

Example 5 Non-Polymeric Small Organic Molecule

Triphenylmethane was used as the release material in the vacuum chamberunder the same conditions of Example 1, except that release material wasmelted at 95° C. and flash-evaporated at about 250° C. The resultingaluminum flakes were approximately 100 angstrom thick, about 10 μm innominal diameter, and optically flat, shiny and reflective. Exposed toair and moisture, they continued to retain their high reflectivity oversix months after manufacture. Several other aromatic compound(anthraquinone, phthalic acid, phthalic anhydride, triphenylene andbenzimidazole) were also tested to manufacture aluminum flakes andproduced with similar results.

Example 6 Polymeric Oligomer

A polyethylene oligomer of molecular weight 4000 (from Aldrich ChemicalCompany of Milwaukee, Wis.) was melted at 130° C. and injected into a10⁻³ to 10⁻⁶ torr vacuum chamber (operated at about 10⁻⁴ torr) to beflash-evaporated at about 300° C. The formed vapor, driven by vacuum,was passed through a slit nozzle from the evaporating area to adeposition chamber and deposited as a solid coating about 0.05-0.10micron thick on a cold drum kept at about 0° C. The release film wasimmediately exposed to a plasma gas of composition 80% Ar, 20% O₂. Analuminum film about 100 Å thick was deposited by resistive evaporationin-line on top of the treated release coating. The speed of the rotatingdrum was limited to about 100 linear meters per minute. Finally, thefilm of aluminum was exposed to a plasma field produced with a plasmagas of composition (80% Ar, 20% O₂). A multilayer sequentialaluminum/release strap (about 5,000 layers) was formed. Afterdeposition, aluminum flakes were produced by crushing the depositedmaterial and then dissolving and extracting the release layers intoluene. The resulting flakes were about 100 Å thick, about 10 μm innominal diameter, and optically flat, shiny and highly reflective.Exposed to air and moisture, they retained their specular reflectivity10 months after manufacture and thereafter.

Example 7 Polymeric Oligomer

A polystyrene oligomer (molecular weight 800-1200) from Aldrich ChemicalCompany of Milwaukee, Wis., was used as the release material in thevacuum chamber under the same conditions of Example 6, except that itwas melted at 200° C. and flash-evaporated at about 350° C. Theresulting aluminum flakes were the same in size, flat, shiny andreflective as in Example 1. Exposed to air and moisture, they continuedto retain their high reflectivity 10 months after manufacture.

Example 8 Polymeric Oligomer

A poly(α-methylstyrene) oligomer (MW 1400) from Aldrich Chemical Companyof Milwaukee, Wis., was used as the release material in the vacuumchamber under the same conditions of Example 6, except that it wasmelted at 180° C. and flash-evaporated at about 350° C. The resultingaluminum flakes were the same in size, flat, shiny and reflective as inExample 1. Exposed to air and moisture, they continued to retain theirhigh specularity 10 months after manufacture.

Example 9 Polymeric Oligomer

Poly(bicycloalyphatic) oligomers (MW 1200) from Kowa AmericanCorporation and San Esters Corporation were used as the release materialin the vacuum chamber under the same conditions of Example 6, exceptthat it was melted at 150° C. and flash-evaporated at about 300° C. Theresulting aluminum flakes were the same in size, flat, shiny andreflective as in Example 1. Exposed to air and moisture, they continuedto retain their high specularity 10 months after manufacture.

Example 10 Monofunctional Polymerizable Monomer

Liquid isobornyl methacrylate monomer from Sartomer Company was injecteddirectly into a 10⁻³ to 10⁻⁶ torr vacuum chamber (operated at about 10⁻⁴torr) to be flash-evaporated at about 220° C. The formed vapor, drivenby vacuum, was passed through a slit nozzle from the evaporating area toa deposition chamber and deposited as a liquid coating about 0.05-0.10micron thick on a cold drum kept at about 0° C. The film was cured byexposure to an electron gun operating at 10 KV and 100 mA and thentreated to smooth its surface with a plasma gas of composition 80% Ar,20% O₂. An aluminum film about 100 Å thick was resistively evaporatedin-line on top of the treated release coating. The speed of the rotatingdrum was kept at about 100 linear meters per minute. Finally, the filmof aluminum was exposed to a plasma field produced with a plasma gas ofcomposition 80% Ar, 20% O₂. A multilayer sequential aluminum/releasestrap (about 5,000 layers) was formed. After deposition, aluminum flakeswere produced by crushing the deposited material and then dissolving andextracting the release layers in ethyl acetate. The resulting flakeswere about 100 Å thick, about 10 μm in nominal diameter, and opticallyflat, shiny and highly reflective. Exposed to air and moisture, theycontinued to retain their high reflectivity 6 months after manufacture.

Example 11 Monofunctional Polymerizable Monomer

Liquid stearyl acrylate monomer from Sartomer Company was used as therelease material in the vacuum chamber under the same conditions ofExample 10 above, except that it was flash-evaporated at about 240° C.The resulting aluminum flakes were the same in size, flat, shiny andreflective as in Example 1. Exposed to air and moisture, they continuedto retain their high reflectivity 6 months after manufacture.

The aluminum flakes so produced were compared to flakes produced by themethod described in Example 1 of Ser. No. 10/355,373 (essentially thesame, except that the polymeric release agent was not treated and thealuminum film was not passivated). Table 1 below shows the difference inthe results obtained from the two processes (referred to as Prior Artand Invention). Reflectivity was measured using a VIS/IRspectrophotometer. Both measurements were conducted on the film obtainedafter conventional mixing of the flakes produced from Examples 1, 5, 9and 10 in a binder and application as a paint.

TABLE 1 REFLECTION, % PRIORT ART INVENTION Example 1 55 93 Example 5 6592 Example 9 60 95 Example 10 50 92

The following examples relate to metallic conductive materials.

Example 12 Non-Polymeric Wax

A paraffin wax from Aldrich Chemical Company of Milwaukee, Wis., wasmelted at 80° C. and injected into a 10⁻³ to 10⁻⁶ torr vacuum chamber(operated at about 10⁻⁴ torr) to be flash-evaporated at about 300° C.The vapor was deposited as a solid coating about 0.05-0.10 micron thickon a cold drum kept at about 0° C. The wax film was immediately exposedto Ar/02 plasma. A silver film about 300 Å thick was resistivelyevaporated in-line on top of the treated release coating. The speed ofthe rotating drum was limited to about 100 linear meters per minute. Amultilayer sequential silver/release strap (about 3000 layers) wasformed. After deposition, silver flakes were produced by crushing thedeposited material and then dissolving and extracting the release layersin toluene. The resulting flakes were about 300 Å thick, about 10 μm innominal diameter, and optically flat, shiny and conductive.

Example 13 Non-Polymeric Wax

A carnouba wax from Aldrich Chemical Company of Milwaukee, Wis., wasused as the release material in the vacuum chamber under the sameconditions of Example 2, except that the organic material was melted at120° C. and flash-evaporated at about 320° C., and copper was depositedin a 300 Å thick film. The resulting copper flakes were the same insize, flat, shiny and conductive

Example 14 Non-Polymeric Small Organic Molecule

Anthracene was used as the release material in the vacuum chamber underthe same conditions of Example 12, except that it was melted at 220° C.and flash-evaporated at about 300° C., and silver was deposited in a 300Å thick film. The resulting silver flakes were the same in size, flat,shiny and conductive.

Example 15 Non-Polymeric Wax

A paraffin wax was used as the release material in the vacuum chamberunder the same conditions of Example 1 except that chromium wasdeposited in a 200 Å thick film. The resulting chromium flakes wereoptically flat, shiny and conductive.

Example 16 Polymeric Oligomer

A polyethylene oligomer of molecular weight 4000 (from Aldrich ChemicalCompany of Milwaukee, Wis.) was melted at 130° C. and injected into a10⁻³ to 10⁻⁶ torr vacuum chamber (operated at about 10⁻⁴ torr) to beflash evaporated at about 300° C. The vapor was deposited as a solidcoating about 0.05-0.10 micron thick on a cold drum kept at about 0° C.A silver film about 300 Å thick was deposited by resistive evaporationin-line on top of the treated release coating. The resulting silverflakes were optically flat, shiny and highly conductive.

Example 17 Monofunctional Polymerizable Monomer

Liquid isobornylacrylate monomer from Sartomer Company was injecteddirectly into a 10⁻³ to 10⁻⁶ torr vacuum chamber (operated at about 10⁻⁴torr) to be flash-evaporated at about 220° C. The vapor was deposited asa liquid coating about 0.05-0.10 micron thick on a cold drum kept atabout 0° C. The film was cured by exposure to an electron gun operatingat 10 KV and 100 mA and then treated to smooth its surface with a plasmagas of composition 80% Ar, 20% O₂. A silver film about 300 Å thick wasresistively evaporated in-line on top of the treated release coating. Amultilayer sequential copper/release strap (about 3000 layers) wasformed from which copper flakes were extracted with ethyl acetate.

The silver and copper flakes so produced were compared to comparableflakes produced by the method described in Ser. No. 10/355,373(essentially the same, except that the polymeric release agent was nottreated as disclosed herein). Table 2 below shows the difference in theconductivity of the products made with flakes obtained from the twoprocesses (referred to as Prior Art and Invention). Surface resistance(as a function of conductivity) was measured using a four-point probe.All measurements were made on the film obtained after conventionalmixing of the flakes in a binder and application as paint.

TABLE 2 (surface resistance, ohm/sq) PRIORT ART INVENTION Example 12 5 1Example 13 3 0.5 Example 16 7 0.5 Example 17 5 0.5

The following examples relate to transparent conductive materials.

Example 18 Non-Polymeric Wax

A paraffin wax from Aldrich Chemical Company of Milwaukee, Wis., wasmelted at 80° C. and injected into a 10⁻³ to 10⁻⁶ torr vacuum chamber(operated at about 10⁻⁴ torr) to be flash-evaporated at about 300° C.The vapor was deposited as a solid coating about 0.05-0.10 micron thickon a cold drum kept at about 0° C. The wax film was immediately exposedto Ar/O₂ plasma. An ITO film about 500 Å thick was sputtered in-line ontop of the organic release coating. The speed of the rotating drum waslimited to about 5 linear meters per minute by the ability to sputterITO, which is significantly slower than the normal rate of vapordeposition of release material. A multilayer sequentialITO/release-coating strap (about 2,000 layers) was formed. Afterdeposition, ITO flakes were produced by crushing the deposited materialand then dissolving the release layers in toluene. The resulting flakeswere about 500 Å thick, about 10 μm in nominal diameter, clear andconductive.

Example 19 Polymeric Oligomer

A poly({dot over (α)}-methylstyrene) oligomer of molecular weight 1300(Aldrich Chemicals) was melted at 150° C., injected into evaporator andevaporated as in Example 18 above. The solid layer was treated and anITO film was deposited as in that example. The resulting flakes wereclear and conductive.

Example 20 Non-Polymeric Small Organic Molecule

Anthracene was used as the release material in the vacuum chamber underthe same conditions of Example 19, except that it was melted at 220° C.and flash-evaporated at about 300° C. and an IZO film about 500 Å thickwas sputtered in-line on top of the release coating. The resulting IZOflakes were clear.

Example 21 Monofunctional Polymerizable Monomer

Liquid isobornylacrylate monomer was injected directly into a vacuumchamber operated at about 10⁻⁴ torr to be flash-evaporated at about 220°C. The vapor was deposited as a liquid coating about 0.05-0.10 micronthick on a cold drum kept at about 0° C. The film was cured by exposureto an electron gun operating at 10 KV and 100 mA and then treated tosmooth its surface with a plasma gas of composition 80% Ar, 20% O₂. AnITO film about 500 Å thick was sputtered in-line on top of the releasecoating. The resulting flakes were clear.

The ITO and IZO flakes so produced were compared to flakes produced bythe method described in Ser. No. 10/355,373 (essentially the same,except that the release agent was not treated). Tables 3 and 4 belowshow the difference in the results obtained from the two processes(referred to as Prior Art and Invention). Optical density was measuredusing an optical densitometer (Model Cosar 70 Compupluse); and surfaceresistance as a function of conductivity was measured using a four-pointprobe. Both measurements were conducted on the film obtained fromdeposition.

TABLE 3 (Optical Density) PRIORT ART INVENTION Example 18 1.2 0.6Example 19 0.9 0.4 Example 20 1.0 0.3 Example 21 0.8 0.3

TABLE 4 (surface resistance, ohm/sq) PRIORT ART INVENTION Example 182000 500 Example 19 4000 700 Example 20 1500 350 Example 21 2500 150

These examples demonstrate the improvements obtained by surface treatingthe release material with a plasma source or ion beam and, in the caseof aluminum, also by passivating both sides of the aluminum film with apassivating treatment in the vacuum process of manufacturing flakes. Theprocess possesses the advantage of producing flat, corrosion-resistantflakes with a controllably high aspect ratio, as needed to yield highlyreflective aluminum paints and improved transparent conductive flakessuitable for inks and coatings used in various commercial applications.Because of the continuous operation and application of the materialsover a rotating drum or moving web, the process produces flakes at muchhigher rates than prior-art chemical and mechanical techniques.

Various changes in the details, steps and components that have beendescribed may be made by those skilled in the art within the principlesand scope of the invention herein illustrated and defined in theappended claims. For example (the web 18 used to carry out thedeposition may be pre-treated with a conventional plasma source 42, asshown in FIGS. 2 and 4, to improve its smoothness prior to deposition ofthe organic layer.

It is also clear that the process can be used advantageously topassivate any metallic multi-layer structure. The following exampleillustrates this advance in the art.

Example 22 Polymerizable Monomer

For instance, a multilayer aluminum and polymer composite material wasproduced for the purpose of making multilayer capacitors using theprocess configuration shown in FIG. 3. A hexanediol diacrylate monomermaterial was flash evaporated and deposited on a rotating drum at athickness of 0.4 μm. The thin liquid layer was cross-linked using anelectron beam. The surface of the polymer layer was then treated with anoxygen-based RF plasma, followed by deposition of a 5 ohm-per-squarealuminum layer that was then segmented into multiple strips. The surfaceof the aluminum layer was passivated with an oxygen-based RF plasma. Theprocess was repeated in a manner such that the aluminum strips in eachelectrode layer were offset to form left and right capacitor electrodes.The capacitor multilayer material (composed of thousands of suchmetal/polymer layers) was removed from the drum and cut into capacitorstrips and chips with a capacitance value of 0.47 μmF (with a toleranceof +/−5%). Capacitor chips produced under these conditions were testedin a pressure cooker for 30 minutes, under steam conditions at 125° C.and 15 psi, with no visible corrosion of the aluminum electrodes orsignificant change in the capacitance value. For comparison, in theabsence of the two passivation plasma treatment steps, the aluminumcapacitor electrodes turned into a hydrated aluminum oxide (clear andtransparent) after the pressure cooker test and the capacitance of theparts was reduced to zero.

Thus, while the present invention has been shown and described herein inwhat is believed to be the most practical and preferred embodiments, itis recognized that departures can be made therefrom within the scope ofthe invention, which is not to be limited to the details disclosedherein but is to be accorded the full scope of the claims so as toembrace any and all equivalent processes and products.

What is claimed is:
 1. A process for producing flake elements, theprocess comprising: a) applying a liquid release layer on a substrate,said release layer having a first thickness; b) hardening a top surfaceof the liquid release layer to form a polymerized top surface athickness of which is smaller than the first thickness; c) depositing alayer of first material on the polymerized top surface to form amultilayer structure on the substrate; d) reducing the multilayerstructure, which has been removed from the substrate, to form flakeelements.
 2. A process of claim 1, further comprising repeating thesteps a) through c) to form said multilayer structure that contains morethan two layers.
 3. A process of claim 1, wherein the applying a liquidrelease layer includes applying a liquid release layer on a rotatingdrum.
 4. A process of claim 1, wherein the applying a liquid releaselayer includes applying a liquid release layer on a polymer web.
 5. Aprocess of claim 1, wherein the depositing a layer of first materialincludes depositing a metallic layer.
 6. A process of claim 5, furthercomprising passivating a top surface of the metallic layer immediatelyafter said depositing.
 7. A process of claim 6, wherein said passivatingincludes passivating using gas plasma that comprises oxygen atoms.
 8. Aprocess of claim 1, wherein said hardening includes hardening withradiation.
 9. A process of claim 1, wherein said hardening includeshardening with radiation generated by at least one of plasma andelectron beam.
 10. A process of claim 1, wherein said applying a liquidrelease layer includes applying an un-polymerized liquid release layer.11. A process of claim 1, wherein said applying a liquid release layerincludes applying at least one of a wax, an oligomer, and small organicmolecules with molecular weight between 200 and 5,000.
 12. A process ofclaim 1, wherein said depositing a layer of first material includesdepositing first material containing at least one of a metal oxide,gold, silver, palladium, platinum, chromium, nickel, indium, and copper.13. A process of claim 1, wherein said reducing the multilayer structureincludes using a solvent.
 14. A process for producing flake elements,the process comprising: a) applying an un-polymerized organic releaselayer on a substrate, said release layer having a first thickness; b)hardening a top surface of the un-polymerized organic layer to form apolymerized top surface a thickness of which is smaller than the firstthickness; c) depositing a layer of first material on the polymerizedtop surface to form a multilayer structure on the substrate; d) reducingthe multilayer structure, which has been removed from the substrate, toform flake elements.
 15. A process of claim 14, further comprisingrepeating the steps a) through c) to form said multilayer structure thatcontains more than two layers.
 16. A process of claim 14, wherein theapplying an un-polymerized organic layer includes applying anun-polymerized organic layer on a rotating drum.
 17. A process of claim14, wherein the applying an un-polymerized organic layer includesapplying an un-polymerized organic layer on a polymer web.
 18. A processof claim 14, wherein the depositing a layer of first material includedepositing a metallic layer.
 19. A process of claim 18, furthercomprising passivating a top surface of the metallic layer immediatelyafter said depositing.
 20. A process of claim 19, wherein saidpassivating includes passivating using gas plasma that comprises oxygenatoms.
 21. A process of claim 14, wherein said hardening includeshardening with radiation.
 22. A process of claim 14, wherein saidhardening includes hardening with radiation generated by at least one ofplasma and electron beam.
 23. A process of claim 14, wherein saidapplying an un-polymerized organic layer includes applying at least oneof a wax, an oligomer, and small organic molecules with molecular weightbetween 200 and 5,000.
 24. A process of claim 14, wherein saiddepositing a layer of first material includes depositing first materialcontaining at least one of a metal oxide, gold, silver, palladium,platinum, chromium, nickel, indium, and copper.
 25. A process of claim14, wherein said reducing the multilayer structure includes using asolvent.